CTFL_Syll_4.0 Exam Dumps : ISTQB Certified Tester Foundation Level (CTFL) v4.0

Comprehensive and Detailed Explanation From Exact Extract:

The test plan is a key document in test management that outlines how testing will be performed for a particular project or product. According to the ISTQB CTFL Syllabus:

“A test plan is a work product that describes the objectives, scope, approach, and focus of a software testing effort… It typically includes details such as schedule, budget, resources, deliverables, risks, and entry and exit criteria.”

(ISTQB CTFL Syllabus v4.0, Section 5.1.1 – Purpose and Content of a Test Plan, Page 47)

Options B, C, and D are not part of thetest planbut belong totest reportsortest executiondocumentation.

The question is about marking the correct sentences among the given statements related to defects, failures, and mistakes. According to the ISTQB glossary, the definitions of these terms are1:

Defect: A flaw in a component or system that can cause the component or system to fail to perform its required function, e.g. an incorrect statement or data definition. A defect, if encountered during execution, may cause a failure of the component or system.

Failure: An event in which a component or system does not perform a required function within specified limits.

Mistake: A human action that produces an incorrect result.

Therefore, out of the five given statements, only two are correct, namely:

A human mistake may produce a defect: This is true, as a mistake is a source or cause of a defect, e.g. a programmer may make a mistake in writing a code statement, which results in a defect in the software component.

When a defect exists in a system it may result in a failure: This is true, as a defect is a potential or actual cause of a failure, e.g. a defect in the software component may cause the system to fail to perform a required function when the defect is encountered during execution.

The other three statements are incorrect, namely:

Defects are a result of environmental conditions and are also referred to as “Failures”: This is false, as defects are not a result of environmental conditions, but of mistakes or other factors, and defects are not the same as failures, but rather the causes of failures.

A system will totally fail to operate correctly when a failure exists in it: This is false, as a system may not necessarily fail completely or stop operating when a failure occurs, but may continue to operate with reduced functionality or performance, or with incorrect results.

Defects occur only as a result of technology changes: This is false, as defects can occur due to various reasons, not only technology changes, such as human mistakes, design flaws, requirement changes, hardware failures, etc.

Boundary Value Analysis (BVA)focuses on test cases at the edges of partitions because defects often occur at boundaries. The temperature ranges are:

≤7 (Too cold → W)

[8-21] (Standstill → X)

[22-29] (Ideal → Y)

≥30 (Too hot → Z)

Atwo-point BVAmeans testing both thelower and upper boundary valuesof each partition.

The correct selection{7,8,21,22,29,30}includes:

7 → Boundary of Too Cold (W)

8 → Lower boundary of Standstill (X)

21 → Upper boundary of Standstill (X)

22 → Lower boundary of Ideal (Y)

29 → Upper boundary of Ideal (Y)

30 → Lower boundary of Too Hot (Z)

This ensures maximum boundary coverage.